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Design Progress | Week 7

  • Oct 7, 2025
  • 2 min read

Dates: 10/01/25 - 10/07/25


This week’s progress involved project documentation, budgeting, and hardware design. First, The project website’s timeline was updated to align with the format recommended by Dr. Ejaz, consolidating milestones and events that share identical date ranges. This approach improves chronological clarity and provides a more streamlined overview of the project’s development phases.


The monetary expenses section underwent a revision to include newly acquired components and materials such as neoprene foam, prototype PCB boards, motor driver ICs, ADC multiplexers, and other essential electronic parts. In addition, the financial tracking page was reorganized to display three distinct charts: the Project Budget, Project Cost, and Single Unit Build Cost. These updates enhance transparency in financial reporting and provide a clear visualization of resource allocation and expenditure.


On the hardware acquisition and prototyping front, in-person visits were conducted to Skycraft Surplus and City Electric Supply to source remaining components. However, due to limited stock availability, the necessary items were ordered online and are currently in transit for the next phase of assembly and performance testing. A variety of perfboards were successfully obtained to support prototyping and circuit testing efforts. Additionally, key components such as the IC multiplexer (MUX) and motor driver ICs were ordered through Digi-Key and are pending delivery to proceed with electrical integration and testing.


Efforts in the week were also directed toward mechanical and CAD development. New fittings for the IR sensor modules were designed and implemented to meet IP52 ingress protection requirements, ensuring the system maintains adequate protection against dust and limited moisture exposure. CAD modeling was completed for the power (latching) and mode select (momentary) push buttons using precise dimensional data from the ordered components. The battery pack design was also refined based on measurements taken with a digital caliper to ensure proper enclosure fitment.


Finally, the newly designed IR sensor front plate housing was 3D-printed and tested for alignment and fit. The results were successful—each IR sensor fit securely and precisely within its designated slot. The next stage will involve physical environmental testing to confirm the enclosure’s resistance to dust ingress and water spray exposure under simulated operating conditions.




 
 
 

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